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A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements

Archive ouverte : Article de revue

Daffe, Khadim | Marzouk, Jaouad | Boyaval, Christophe | Dambrine, Gilles | Haddadi, Kamel | Arscott, S.

Edité par HAL CCSD ; IOP Publishing

International audience. Miniaturized, microfabricated microelectromechanical systems (MEMS)-based wafer probes are used here to evaluate different contact pad metallization at low tip forces (1000 Nm-1) and small contact pads enabled us to show that it is the length of the pad (in contact with the surface) which determines the contact resistivity rather than the total contact pad area.

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