A new equivalent circuit scheme for grounded back-to-back GCPW-MS-GCPW transitions fabricated on a thin low-k substrate

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Dugué, Pierre-Vincent | El Gibari, Mohammed | Halbwax, Mathieu | Ginestar, Stephane | Avramovic, Vanessa | Vilcot, Jean-Pierre | Li, Hong Wu

Edité par HAL CCSD ; EMW Publishing

International audience. We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW for Grounded CoplanarWaveguide and MS for Microstrip). In order to validate the modelling results, such transitions have been fabricated on a 20 μm-thick BCB (Benzocyclobutene resin) substrate using grounding pads including via-holes of different diameters. The study focused on the impact of the via-hole diameter on the performance of the transition and more specifically on its bandwidth. The transitions were made using a simple technological process based on photosensitive polymer. ADS simulation data of the new equivalent circuit model were in very good agreement with measured S-parameters. Both theoretical and experimental results have shown that the bandwidth of such a transition can reach up to 100 GHz using via-holes of 900 μm diameter.

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